Role Details : Process Engineer - Wafer saw and Package saw Position Code : ( 126)Job location : Sanand, Ahmedabad [ Gujrat ]Edu & Exp. : 04 years to 10 years BE ( Mechanical / Electrical & Electronics / Electronics & Computers ).Company Overview : CG Semi Private Limited, a subsidiary of CG Power and Industrial Solutions Limited, is a pioneering joint venture with Renesas Electronics Corporation and Stars Microelectronics (Thailand) Public Co. Ltd. Our state-of-the-art OSAT facility in Sanand is a significant milestone in Indias high-tech manufacturing landscape, dedicated to producing a diverse range of semiconductor packages for industries including Automotive, Consumer Electronics, Industrial Manufacturing, and 5G technology.Process Engineer - Wafer saw and Package saw Position Code ( 126)Wafer saw / package saw process engineer, is responsible for designing, developing, deploying and optimizing processes to achieve quality cost and delivery goals for CG Semiconductor and its customers products.Qualification : BE ( Mechanical / Electrical & Electronics / Electronics & Computers ) Experience : 04 - 10 years of experience in die attach, flip chip attach process development preferred.Detailed DescriptionPerforms tasks such as, but not limited to, the following:Strong knowledge on wafer saw and package saw process and basic understanding of the machine functions.Able to design and develop process parameters to meet the yield, productivity and cost as required by the department or company.Able to work with training department to develop technical training manuals.Deep understanding on metallurgy and material properties and fatigue knowledge is preferred. Develop detailed and meaningful OCAP for effective trouble shooting guide for line people. Supervise Technicians and support whenever needed.Able to develop and update work Instruction (WI), Control plan, PFMEA and FA documents support.Continuous process improvement activities utilizing wide variety of analytical techniques (such as SPC, DOE, Gauge R&R), lean manufacturing and six sigma concepts.Leader in Product quality improvement, DFM, DFA, Engineering Evaluation.Analyse losses (planned & unplanned downtime) and develop action to reduce losses to improve OEE.Able to deal with customer request and good communication with customers and vendors.Evaluation of new material or component part use in production.Evaluation and develop Process and new Technology.Knowledge/Skills/CompetenciesTypical ExperienceMin 2 years experience in back grind process development is preferred.Work Experience and understand in semiconductor assembly line is required.Strong Knowledge on sensors, bearings, drive mechanism, diamond studded saw blade knowledge is preferred.Hands-on experience in machine set-up and operation for wafer and package saw machine (Disco) is an advantageProficient in root cause and failure mode AnalysisFamiliar with cleanroom and ESD protocolsKnowledge of Auto CAD 2D, 3D or Solid work program is preferred.Excellent interpersonal skills and demonstrated communication skills.Self-motivated, proactive and innovative problem-solving capabilities, Management skill and Presentation skill.Able to motivate and inspire people to achieve daily targets.Why Join Us?At CG Semi, youll be part of a ground breaking initiative shaping the future of semiconductor manufacturing in India. Join our team and contribute to a culture of innovation and excellence.Regards I Talent Acquisition TeamCG Semi Private Limitedsubsidiary of [ CG Power & Industrial Solutions Limited ]Tube Investments of India Limited [ Murugappa Group ]Linkedin : https://www.linkedin.com/company/cg-semi-private-limitedRegards I Talent Acquisition Team