System Architect

Job Description

About Us: Tessolve offers a unique combination of pre-silicon and post-silicon expertise to provide an efficient turnkey solution for silicon bring-up, and spec to the product. With 3200+ employees worldwide, Tessolve provides a one-stop-shop solution with full-fledged hardware and software capabilities, including its advanced silicon and system testing labs. Tessolve offers a Turnkey ASIC Solution, from design to packaged parts. Tessolves design services include solutions on advanced process nodes with a healthy eco-system relationship with EDA, IP, and foundries. Our front-end design strengths integrated with the knowledge from the backend flow, allows Tessolve to catch design flaws ahead in the cycle, thus reducing expensive re-design costs, and risks. We actively invest in the R&D center of excellence initiatives such as 5G, mmWave, Silicon photonics, HSIO, HBM/HPI, system-level test, and others. Tessolve also offers end-to-end product design services in the embedded domain from concept to manufacturing under an ODM model with application expertise in Avionics, Automotive, Industrial and Medical segments. Tessolve’s Embedded Engineering services enable customers a faster time-to-market through deep domain expertise, innovative ideas, diverse embedded hardware & software services, and built-in infrastructure with world-class lab facilities. Tessolve’s clientele includes Tier 1 clients across multiple market segments, 9 of the top 10 semiconductor companies, start-ups, and government entities. We have a global presence over 12 countries with office locations in the United States, India, Singapore, Malaysia, Germany, United Kingdom, Canada, UK, Japan, Taiwan, Philippines, and Test Labs in India, Singapore, Malaysia, Austin, San Jose. For more details, visit www.tessolve.com. Job Overview Brief description about the Job. Job Summary: We are looking for a highly skilled Hardware Engineer to lead the development, selection, and integration of hardware components for our Two-Wheeler Connected TCU and Digital Cluster solutions. The ideal candidate will play a crucial role in defining the Bill of Materials (BOM), electrical and mechanical design, PCB layout, and system integration. This individual should have deep expertise in automotive-grade hardware, PCB design, power management, and connectivity solutions. The role requires close collaboration with ODM partners, chipset manufacturers, and cross-functional teams to bring innovative connected two-wheeler solutions to market. Key Responsibilities: Hardware Architecture & Development: Define and develop hardware architecture for two-wheeler connected TCU & cluster solutions. Lead the selection of chipsets, sensors, controllers, and connectivity modules (4G/5G, GNSS, Bluetooth, WiFi, V2X). Oversee the PCB design, layout, and component placement to meet performance, thermal, and reliability requirements. Bill of Materials (BOM) & Component Selection: Define and optimize BOM for cost-effective, high-performance, and automotive-grade components. Evaluate and source processors, memory, power management ICs, RF modules, and interface components. Work closely with Qualcomm, MediaTek, NXP, STMicroelectronics, and other chipset vendors. Connectivity & Communication: Design and integrate cellular, GNSS, WiFi, Bluetooth, and V2X communication hardware for telematics and infotainment systems. Ensure compatibility with automotive networking protocols (CAN, LIN, Ethernet, UDS, SPI, I2C, UART). Power Management & Thermal Design: Develop efficient power distribution and thermal management solutions for battery-powered two-wheeler devices. Optimize DC-DC converters, PMICs, and battery management systems (BMS). Mechanical Design & Durability: Collaborate on mechanical enclosures, environmental protection (IP ratings), and vibration resistance. Ensure compliance with automotive-grade durability and safety standards. Regulatory Compliance & Testing: Ensure EMC/EMI compliance, functional safety (ISO 26262), and automotive certification. Oversee hardware validation, environmental testing, and reliability assessment. Collaboration & Prototyping: Work closely with ODM partners, Tier-1 suppliers, and internal software teams. Lead hardware prototyping, testing, and debugging to achieve performance targets. Required Skills & Experience: 7+ years of experience in hardware engineering, particularly in automotive electronics, telematics, or infotainment systems. Strong expertise in PCB design, high-speed signal integrity, and multi-layer board design. Hands-on experience with chipsets from Qualcomm, MediaTek, NXP, Renesas, STMicroelectronics, and similar. Proficiency in power management systems, battery integration, and automotive-grade circuit design. Strong understanding of cellular communication hardware (4G/5G, LTE, GNSS, WiFi, Bluetooth, V2X, UWB, NFC). Experience with CAN, LIN, SPI, I2C, UART, Ethernet, and automotive bus protocols. Knowledge of automotive EMI/EMC standards, ESD protection, and functional safety (ISO 26262). Hands-on experience with hardware validation, RF testing, and automotive compliance certification. Familiarity with thermal modeling, mechanical integration, and enclosure design. Ability to work with ODM partners and Tier-1 suppliers to bring hardware concepts to production. Preferred Qualifications: Master’s or Bachelor's degree in Electrical Engineering, Electronics, or related field. Experience in automotive cybersecurity hardware design (UNECE WP.29, ISO 21434). Knowledge of ADAS, AI-based automotive electronics, and sensor fusion technologies. Experience with cloud-connected telematics, OTA updates, and real-time diagnostics hardware. Understanding of AI/ML-based vehicle data processing for predictive maintenance. If you are a highly skilled hardware engineer passionate about automotive connectivity and telematics, we invite you to be part of our next-gen two-wheelJob Location : Electronic -City, Phase – II, Bangalore. What you’ll do Please update the roles and responsibilities Who you are Please update experience and skills set needed. Tessolve Semiconductor Private Limited, as well as its affiliates and subsidiaries (“Tessolve”) does not require job applicants to make any payments at any stage of the hiring process. Any request for payment in exchange for a job opportunity at Tessolve is fraudulent and should be ignored. If you receive any such communication, we strongly advise you to refrain from making any payments and to promptly report the incident to us at hr@tessolve.com. Tessolve is not responsible for any losses incurred due to such fraudulent activities